FIG. 1 is a perspective view of an air cooler showing my new design;
FIG. 2 is a left side elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is an enlarged view of circled portion 8 in FIG. 2;
FIG. 9 is a perspective view of a second embodiment of an air cooler of my new design;
FIG. 10 is a left side elevational view of FIG. 9;
FIG. 11 is a right side elevational view of FIG. 9;
FIG. 12 is a front elevational view of FIG. 9;
FIG. 13 is a rear elevational view of FIG. 9;
FIG. 14 is a top plan view of FIG. 9;
FIG. 15 is a bottom plan view of FIG. 9; and,
FIG. 16 is an enlarged view of circled portion 16 in FIG. 10.
Patent |
Priority |
Assignee |
Title |
6161611, |
Jul 09 1999 |
Asai Vital Components Co., Ltd. |
Radiator |
6373701, |
Jun 14 2000 |
Foxconn Precision Components Co., Ltd. |
Heat dissipation assembly |
6633485, |
Nov 20 2002 |
Illinois Tool Works Inc. |
Snap-in heat sink for semiconductor mounting |
7254888, |
Jan 10 2003 |
International Business Machines Corporation |
Method for manufacturing graphite-base heat sinks |
7487825, |
Oct 31 2006 |
FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD |
Heat dissipation device |
7643300, |
Dec 16 2008 |
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. |
Heat dissipation device for memory module cards |
7760509, |
Jun 16 2009 |
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. |
Heat dissipation device having fastening structure |
20020023732, |
|
|
|
20060237167, |
|
|
|
20070102147, |
|
|
|
D277748, |
Sep 30 1982 |
LASALLE BUSINESS CREDIT, INC |
Pinned-extrusion heat sink for electronic devices |
D384040, |
Apr 19 1996 |
WAKEFIELD THERMAL SOLUTIONS, INC |
Heat sink |
D450044, |
Jun 14 2000 |
|
Cooler for heat dissipation |
D494549, |
Apr 14 2003 |
Zalman Tech Co., Ltd. |
Supporting block of VGA chipset cooling device |
D592613, |
Jun 18 2008 |
4187318 CANADA INC |
Heat sink |
D609199, |
Jun 16 2009 |
CompTake Technology Inc. |
Heat sink for read only memory device |
D610557, |
Jun 16 2009 |
CompTake Technology Inc. |
Heat sink for read only memory device |