Patent
   D609199
Priority
Jun 16 2009
Filed
Jun 16 2009
Issued
Feb 02 2010
Expiry
Feb 02 2024
Assg.orig
Entity
unknown
2
5
n/a
The ornamental design for a heat sink for read only memory device, as shown and described.

FIG. 1 is a perspective view of a heat sink for read only memory device showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

Chen, Wei-Hau, Yen, Shih-Hsi

Patent Priority Assignee Title
D689829, Jan 02 2013 CompTake Technology Inc. Heat dissipating module of memory
D693316, May 13 2011 SAPA Profiler AB Air cooler
Patent Priority Assignee Title
5986888, Jun 09 1997 Power Trends, Inc. Heat sink for auxiliary circuit board
D266074, May 30 1980 Showa Aluminum Kabushiki Kaisha Heat releasing plate for mounting semiconductor components
D266080, Mar 31 1980 Showa Aluminum Kabushiki Kaisha Heat releasing plate for mounting semiconductor components
D266082, Mar 30 1980 Showa Aluminum Kabushiki Kaisha Heat releasing plate for mounting semiconductor components
D384040, Apr 19 1996 WAKEFIELD THERMAL SOLUTIONS, INC Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 26 2009CHEN, WEI-HAUCOMPTAKE TECHNOLOGY INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0228300752 pdf
May 26 2009YEN, SHIH-HSICOMPTAKE TECHNOLOGY INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0228300752 pdf
Jun 16 2009CompTake Technology Inc.(assignment on the face of the patent)
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