Patent
   D266074
Priority
May 30 1980
Filed
May 30 1980
Issued
Sep 07 1982
Expiry
Sep 07 1996
Assg.orig
Entity
unknown
3
4
n/a
The ornamental design for heat releasing plate for mounting semiconductor components, as shown and described.

FIG. 1 is a front view of the heat releasing plate for mounting semi-conductor components showing the new design;

FIG. 2 is a plan view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof; and

FIG. 6 is a sectional view taken on line 6--6 of FIG. 1.

Asanuma, Yoshihiko

Patent Priority Assignee Title
D609199, Jun 16 2009 CompTake Technology Inc. Heat sink for read only memory device
D610557, Jun 16 2009 CompTake Technology Inc. Heat sink for read only memory device
D846513, Apr 27 2016 NGK Insulators, Ltd. Sheet heater for electrostatic chuck
Patent Priority Assignee Title
2949283,
3163207,
3180404,
3187812,
/
Executed onAssignorAssigneeConveyanceFrameReelDoc
May 30 1980Showa Aluminum Kabushiki Kaisha(assignment on the face of the patent)
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