Patent
   D610557
Priority
Jun 16 2009
Filed
Jun 16 2009
Issued
Feb 23 2010
Expiry
Feb 23 2024
Assg.orig
Entity
unknown
11
5
n/a
The ornamental design for a heat sink for read only memory device, as shown and described.

FIG. 1 is a perspective view of a heat sink for read only memory device showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

Chen, Wei-Hau, Yen, Shih-Hsi

Patent Priority Assignee Title
D626520, Mar 23 2010 CompTake Technology Inc. Heat-dissipating device for memory
D626521, Mar 23 2010 CompTake Technology Inc. Heat-dissipating device for memory
D657756, Oct 17 2011 Corsair Memory, Inc Low profile heat spreader for a computer memory module
D659110, Mar 23 2010 ComTake Technology, Inc. Heat-dissipating device for memory
D660810, Oct 17 2011 Corsair Memory, Inc Heat spreader with fins for a computer memory module
D693316, May 13 2011 SAPA Profiler AB Air cooler
D717251, Jul 18 2012 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
D717744, Aug 30 2013 Corsair Memory, Inc Heat spreader on a memory module
D761744, Jul 18 2012 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
D789718, Sep 02 2015 Heatcraft Refrigeration Products LLC Plastic shelf liner for merchandising display cases
D801094, Apr 15 2015 RICERCHE DI ARCHITETTURA LOGICA PER AMBIENTI DI GUIDO SARTORETTO VERNA - SOCIETÀ IN NOME COLLETTIVO Furniture shelf with front element
Patent Priority Assignee Title
5986888, Jun 09 1997 Power Trends, Inc. Heat sink for auxiliary circuit board
D266074, May 30 1980 Showa Aluminum Kabushiki Kaisha Heat releasing plate for mounting semiconductor components
D266080, Mar 31 1980 Showa Aluminum Kabushiki Kaisha Heat releasing plate for mounting semiconductor components
D266082, Mar 30 1980 Showa Aluminum Kabushiki Kaisha Heat releasing plate for mounting semiconductor components
D384040, Apr 19 1996 WAKEFIELD THERMAL SOLUTIONS, INC Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 26 2009CHEN, WEI-HAUCOMPTAKE TECHNOLOGY INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0228300752 pdf
May 26 2009YEN, SHIH-HSICOMPTAKE TECHNOLOGY INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0228300752 pdf
Jun 16 2009CompTake Technology Inc.(assignment on the face of the patent)
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