Patent
   D626521
Priority
Mar 23 2010
Filed
Mar 23 2010
Issued
Nov 02 2010
Expiry
Nov 02 2024
Assg.orig
Entity
unknown
8
22
n/a
The ornamental design for an heat-dissipating device for memory, as shown and described.

FIG. 1 is a perspective view of an heat-dissipating device for memory showing my new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is an application diagram thereof; and,

FIG. 9 is an another application diagram thereof.

The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.

Chen, Wei-Hau, Kuo, Cheng-Hsien, Chen, Shih-Her

Patent Priority Assignee Title
D657756, Oct 17 2011 Corsair Memory, Inc Low profile heat spreader for a computer memory module
D660810, Oct 17 2011 Corsair Memory, Inc Heat spreader with fins for a computer memory module
D717251, Jul 18 2012 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
D717744, Aug 30 2013 Corsair Memory, Inc Heat spreader on a memory module
D761744, Jul 18 2012 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
D927435, Apr 12 2019 SHIN-ETSU POLYMER CO , LTD ; Daimler AG Heat dissipating device for batteries or electric devices
D956706, Aug 06 2020 ESSENCORE Limited Heat sink for memory modules
D962880, Aug 06 2020 ESSENCORE Limited Heat sink for memory modules
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 12 2010CHEN, WEI-HAUCOMPTAKE TECHNOLOGY INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0241250862 pdf
Mar 12 2010KUO, CHENG-HSIENCOMPTAKE TECHNOLOGY INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0241250862 pdf
Mar 12 2010CHEN, SHIH-HERCOMPTAKE TECHNOLOGY INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0241250862 pdf
Mar 23 2010CompTake Technology Inc.(assignment on the face of the patent)
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