Patent
   D956706
Priority
Aug 06 2020
Filed
Aug 06 2020
Issued
Jul 05 2022
Expiry
Jul 05 2037
Assg.orig
Entity
unknown
1
23
n/a
The ornamental design for a heat sink for memory modules, as shown and described.

FIG. 1 is a top, front perspective view of the heat sink for memory modules;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

Chung, Young Suk

Patent Priority Assignee Title
D964947, Jun 03 2021 KINGSTON DIGITAL, INC. Heat sink for memory module
Patent Priority Assignee Title
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Aug 03 2020CHUNG, YOUNG SUKESSENCORE LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0534190304 pdf
Aug 06 2020ESSENCORE Limited(assignment on the face of the patent)
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