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Patent
D597966
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Priority
Oct 09 2008
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Filed
Oct 09 2008
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Issued
Aug 11 2009
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Expiry
Aug 11 2023
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Assg.orig
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Entity
unknown
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12
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9
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n/a
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The ornamental design for memory heat sink, as shown and described.
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FIG. 1 is a perspective view of memory heat sink showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
Shih, Po-Wen
Patent |
Priority |
Assignee |
Title |
D657756, |
Oct 17 2011 |
Corsair Memory, Inc |
Low profile heat spreader for a computer memory module |
D660810, |
Oct 17 2011 |
Corsair Memory, Inc |
Heat spreader with fins for a computer memory module |
D689829, |
Jan 02 2013 |
CompTake Technology Inc. |
Heat dissipating module of memory |
D717251, |
Jul 18 2012 |
Corsair Memory, Inc. |
Heat spreader with fins and top bar on a memory module |
D717744, |
Aug 30 2013 |
Corsair Memory, Inc |
Heat spreader on a memory module |
D761744, |
Jul 18 2012 |
Corsair Memory, Inc. |
Heat spreader with fins and top bar on a memory module |
D842304, |
Dec 21 2017 |
Corsair Memory, Inc. |
Memory module |
D868069, |
Jun 29 2017 |
V-COLOR TECHNOLOGY INC. |
Memory device |
D897345, |
Dec 07 2018 |
|
Double-data-rate SDRAM card |
D954061, |
Dec 07 2018 |
|
Double-data-rate SDRAM card |
D956706, |
Aug 06 2020 |
ESSENCORE Limited |
Heat sink for memory modules |
D962880, |
Aug 06 2020 |
ESSENCORE Limited |
Heat sink for memory modules |
Patent |
Priority |
Assignee |
Title |
7151668, |
Oct 28 2004 |
Muskin, Inc. |
Memory heat sink |
7221569, |
Sep 15 2004 |
COMPTAKE TECHNOLOGY INC |
Memory heat-dissipating device |
7365985, |
Sep 29 2004 |
Super Talent Electronics, Inc. |
Memory module assembly including heat sink attached to integrated circuits by adhesive |
7375964, |
Mar 25 2006 |
FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD |
Memory module assembly including a clamp for mounting heat sinks thereon |
7391613, |
May 12 2006 |
FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD |
Memory module assembly including a clamp for mounting heat sinks thereon |
7532477, |
Jan 22 2007 |
LEMTECH PRECISION MATERIAL CHINA CO , LTD |
Memory module and heat sink arrangement |
20030026076, |
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20070165382, |
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20090122481, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a