Patent
   D597966
Priority
Oct 09 2008
Filed
Oct 09 2008
Issued
Aug 11 2009
Expiry
Aug 11 2023
Assg.orig
Entity
unknown
12
9
n/a
The ornamental design for memory heat sink, as shown and described.

FIG. 1 is a perspective view of memory heat sink showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

Shih, Po-Wen

Patent Priority Assignee Title
D657756, Oct 17 2011 Corsair Memory, Inc Low profile heat spreader for a computer memory module
D660810, Oct 17 2011 Corsair Memory, Inc Heat spreader with fins for a computer memory module
D689829, Jan 02 2013 CompTake Technology Inc. Heat dissipating module of memory
D717251, Jul 18 2012 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
D717744, Aug 30 2013 Corsair Memory, Inc Heat spreader on a memory module
D761744, Jul 18 2012 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
D842304, Dec 21 2017 Corsair Memory, Inc. Memory module
D868069, Jun 29 2017 V-COLOR TECHNOLOGY INC. Memory device
D897345, Dec 07 2018 Double-data-rate SDRAM card
D954061, Dec 07 2018 Double-data-rate SDRAM card
D956706, Aug 06 2020 ESSENCORE Limited Heat sink for memory modules
D962880, Aug 06 2020 ESSENCORE Limited Heat sink for memory modules
Patent Priority Assignee Title
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7375964, Mar 25 2006 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Memory module assembly including a clamp for mounting heat sinks thereon
7391613, May 12 2006 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Memory module assembly including a clamp for mounting heat sinks thereon
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 08 2008SHIH, PO-WENAsustek Computer IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0216630426 pdf
Oct 09 2008AsusTek Computer Inc.(assignment on the face of the patent)
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