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Patent
D717744
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Priority
Aug 30 2013
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Filed
Aug 30 2013
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Issued
Nov 18 2014
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Expiry
Nov 18 2028
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Assg.orig
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Entity
unknown
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12
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20
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n/a
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The ornamental design for a heat spreader on a memory module, as shown and described.
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FIG. 1 is a front right side perspective view of a heat spreader on a memory module showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top view thereof; and,
FIG. 5 is a bottom view thereof.
The shade lines in the figures show contour and not surface ornamentation.
Mueller, Martin
Patent |
Priority |
Assignee |
Title |
D761744, |
Jul 18 2012 |
Corsair Memory, Inc. |
Heat spreader with fins and top bar on a memory module |
D842304, |
Dec 21 2017 |
Corsair Memory, Inc. |
Memory module |
D862402, |
Dec 18 2017 |
KINGSTON DIGITAL, INC. |
Memory heat dissipation sink |
D863311, |
Jun 26 2018 |
Corsair Memory, Inc. |
Memory module |
D868069, |
Jun 29 2017 |
V-COLOR TECHNOLOGY INC. |
Memory device |
D897345, |
Dec 07 2018 |
|
Double-data-rate SDRAM card |
D909979, |
Nov 28 2017 |
Tai-Sol Electronics Co., Ltd. |
Vapor chamber |
D951937, |
Dec 06 2018 |
Samsung Electronics Co., Ltd. |
Solid state drive storage device |
D954061, |
Dec 07 2018 |
|
Double-data-rate SDRAM card |
D963442, |
Jan 22 2021 |
New Pig Corporation |
Installation panel for mats |
D964947, |
Jun 03 2021 |
KINGSTON DIGITAL, INC. |
Heat sink for memory module |
ER712, |
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Patent |
Priority |
Assignee |
Title |
6297966, |
Dec 24 1998 |
Foxconn Precision Components Co., Ltd. |
Memory module having improved heat dissipation and shielding |
7365985, |
Sep 29 2004 |
Super Talent Electronics, Inc. |
Memory module assembly including heat sink attached to integrated circuits by adhesive |
7382617, |
Jan 16 2006 |
Nanya Technology Corporation |
Heat sink assembly |
7391613, |
May 12 2006 |
FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD |
Memory module assembly including a clamp for mounting heat sinks thereon |
7606035, |
Sep 22 2006 |
Samsung Electronics Co., Ltd. |
Heat sink and memory module using the same |
8081474, |
Dec 18 2007 |
GOOGLE LLC |
Embossed heat spreader |
20020039282, |
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20030076657, |
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20050264998, |
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20070070607, |
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20070263360, |
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20090168356, |
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20100038054, |
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20100175852, |
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D597966, |
Oct 09 2008 |
AsusTek Computer Inc. |
Memory heat sink |
D610557, |
Jun 16 2009 |
CompTake Technology Inc. |
Heat sink for read only memory device |
D626520, |
Mar 23 2010 |
CompTake Technology Inc. |
Heat-dissipating device for memory |
D626521, |
Mar 23 2010 |
CompTake Technology Inc. |
Heat-dissipating device for memory |
D657756, |
Oct 17 2011 |
Corsair Memory, Inc |
Low profile heat spreader for a computer memory module |
D660810, |
Oct 17 2011 |
Corsair Memory, Inc |
Heat spreader with fins for a computer memory module |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 30 2013 | | Corsair Memory, Inc. | (assignment on the face of the patent) | | / |
Nov 08 2013 | MUELLER, MARTIN | Corsair Memory, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031574 | /0860 |
pdf |
Jul 11 2014 | Corsair Memory, Inc | BANK OF AMERICA, N A , AS AGENT | NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS | 033341 | /0422 |
pdf |
Jul 11 2014 | CORSAIR COMPONENTS, INC | BANK OF AMERICA, N A , AS AGENT | NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS | 033341 | /0422 |
pdf |
Aug 28 2017 | BANK OF AMERICA, N A | CORSAIR COMPONENTS, INC | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 043462 | /0205 |
pdf |
Aug 28 2017 | Corsair Memory, Inc | MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT | FIRST LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT | 043967 | /0980 |
pdf |
Aug 28 2017 | Corsair Memory, Inc | MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT | SECOND LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT | 043714 | /0171 |
pdf |
Aug 28 2017 | BANK OF AMERICA, N A | Corsair Memory, Inc | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 043462 | /0205 |
pdf |
Sep 04 2020 | MACQUARIE CAPITAL FUNDING LLC | CORSAIR MEMORY INC | TERMINATION AND RELEASE OF SECOND LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY RECORDED AT REEL 043714, FRAME 0171 | 053706 | /0930 |
pdf |
Sep 04 2020 | MACQUARIE CAPITAL FUNDING LLC | ORIGIN PC, LLC | TERMINATION AND RELEASE OF SECOND LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY RECORDED AT REEL 043714, FRAME 0171 | 053706 | /0930 |
pdf |
Sep 03 2021 | Corsair Memory, Inc | BANK OF AMERICA, N A , AS ADMINISTRATIVE AGENT | NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS | 057407 | /0001 |
pdf |
Sep 03 2021 | MACQUARIE CAPITAL FUNDING LLC | Corsair Memory, Inc | TERMINATION AND RELEASE OF FIRST LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY | 057424 | /0357 |
pdf |
Sep 03 2021 | MACQUARIE CAPITAL FUNDING LLC | ORIGIN PC, LLC | TERMINATION AND RELEASE OF FIRST LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY | 057424 | /0357 |
pdf |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a