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Patent
D626520
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Priority
Mar 23 2010
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Filed
Mar 23 2010
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Issued
Nov 02 2010
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Expiry
Nov 02 2024
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Assg.orig
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Entity
unknown
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7
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22
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n/a
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The ornamental design for an heat-dissipating device for memory, as shown and described.
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FIG. 1 is a perspective view of an heat-dissipating device for memory showing my new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is an application diagram thereof; and,
FIG. 9 is an another application diagram thereof.
The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.
Chen, Wei-Hau, Kuo, Cheng-Hsien, Chen, Shih-Her
Patent |
Priority |
Assignee |
Title |
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Radiating fin assembly and thermal module formed therefrom |
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Oct 17 2011 |
Corsair Memory, Inc |
Low profile heat spreader for a computer memory module |
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Oct 17 2011 |
Corsair Memory, Inc |
Heat spreader with fins for a computer memory module |
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Jul 18 2012 |
Corsair Memory, Inc. |
Heat spreader with fins and top bar on a memory module |
D717744, |
Aug 30 2013 |
Corsair Memory, Inc |
Heat spreader on a memory module |
D761744, |
Jul 18 2012 |
Corsair Memory, Inc. |
Heat spreader with fins and top bar on a memory module |
D927435, |
Apr 12 2019 |
SHIN-ETSU POLYMER CO , LTD ; Daimler AG |
Heat dissipating device for batteries or electric devices |
Patent |
Priority |
Assignee |
Title |
6297966, |
Dec 24 1998 |
Foxconn Precision Components Co., Ltd. |
Memory module having improved heat dissipation and shielding |
6672379, |
Jul 29 2002 |
Waffer Technology Corp.; Jack, Wang |
Positioning and buckling structure for use in a radiator |
6765799, |
Mar 21 2003 |
GOLDEN SUN NEWS TECHNIQUES CO , LTD ; HUANG, JIN-ZONG |
Heat dissipating fins interlocking mechanism |
6842342, |
Sep 12 2003 |
Leohab Enterprise Co., Ltd. |
Heat sink |
6880621, |
Feb 14 2003 |
|
Radiator |
7190595, |
Sep 22 2004 |
|
Protecting device of a memory module |
7457122, |
Feb 22 2006 |
FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD |
Memory module assembly including a clip for mounting a heat sink thereon |
7721790, |
Oct 31 2006 |
Foxconn Technology Co., Ltd. |
Heat sink |
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Dec 20 2008 |
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Heat radiating member mounting structure |
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Aug 16 2002 |
DATECH TECHNOLOGY CO , LTD |
Heat sink |
D531965, |
Oct 28 2004 |
Mushkin, Inc. |
Memory card heat sink |
D610557, |
Jun 16 2009 |
CompTake Technology Inc. |
Heat sink for read only memory device |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a