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Patent
D689829
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Priority
Jan 02 2013
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Filed
Jan 02 2013
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Issued
Sep 17 2013
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Expiry
Sep 17 2027
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Assg.orig
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Entity
unknown
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17
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17
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n/a
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The ornamental design for a heat dissipating module of memory, as shown and described.
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FIG. 1 is a perspective view of a heat dissipating module of memory showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and
FIG. 8 is the other perspective view showing the heat dissipating module of memory; and,
FIG. 9 is a perspective view of the heat dissipating module of memory for reference.
The broken lines shown represent unclaimed subject matter and form no part of the claimed design.
Chen, Hsin-An, Chen, Wei-Hau, Ku, Chia-Yuan, Chen, Li-Hsu
Patent |
Priority |
Assignee |
Title |
D793400, |
May 09 2016 |
KINGSTON DIGITAL, INC. |
Heat sink for memory module |
D802543, |
May 13 2011 |
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Cooling fin |
D842304, |
Dec 21 2017 |
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D862402, |
Dec 18 2017 |
KINGSTON DIGITAL, INC. |
Memory heat dissipation sink |
D868069, |
Jun 29 2017 |
V-COLOR TECHNOLOGY INC. |
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D889052, |
Mar 17 2020 |
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Nov 30 2018 |
Samsung Electronics Co., Ltd. |
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D896231, |
Nov 30 2018 |
Samsung Electronics Co., Ltd. |
SSD storage device |
D897345, |
Dec 07 2018 |
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Double-data-rate SDRAM card |
D927435, |
Apr 12 2019 |
SHIN-ETSU POLYMER CO , LTD ; Daimler AG |
Heat dissipating device for batteries or electric devices |
D951937, |
Dec 06 2018 |
Samsung Electronics Co., Ltd. |
Solid state drive storage device |
D954061, |
Dec 07 2018 |
|
Double-data-rate SDRAM card |
D956706, |
Aug 06 2020 |
ESSENCORE Limited |
Heat sink for memory modules |
D962880, |
Aug 06 2020 |
ESSENCORE Limited |
Heat sink for memory modules |
D964947, |
Jun 03 2021 |
KINGSTON DIGITAL, INC. |
Heat sink for memory module |
ER712, |
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Patent |
Priority |
Assignee |
Title |
6377460, |
May 27 1999 |
Polaris Innovations Limited |
Electronic circuit having a flexible intermediate layer between electronic components and a heat sink |
7215551, |
Sep 29 2004 |
SUPER TALENT TECHNOLOGY, CORP |
Memory module assembly including heat sink attached to integrated circuits by adhesive |
7221569, |
Sep 15 2004 |
COMPTAKE TECHNOLOGY INC |
Memory heat-dissipating device |
7312996, |
Mar 14 2005 |
|
Heat sink for memory strips |
7391613, |
May 12 2006 |
FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD |
Memory module assembly including a clamp for mounting heat sinks thereon |
7447024, |
Jul 17 2007 |
|
Heat sink for a memory |
7457122, |
Feb 22 2006 |
FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD |
Memory module assembly including a clip for mounting a heat sink thereon |
7606035, |
Sep 22 2006 |
Samsung Electronics Co., Ltd. |
Heat sink and memory module using the same |
7738252, |
Jan 09 2006 |
Kioxia Corporation |
Method and apparatus for thermal management of computer memory modules |
7768785, |
Sep 29 2004 |
Super Talent Electronics, Inc. |
Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive |
7839643, |
Feb 17 2006 |
Netlist, Inc. |
Heat spreader for memory modules |
8411443, |
Jan 21 2011 |
CompTake Technology Inc. |
Slidingly-engaged heat-dissipating assembly for memory and memory device having the same |
20030026076, |
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20090122481, |
|
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|
D597966, |
Oct 09 2008 |
AsusTek Computer Inc. |
Memory heat sink |
D609199, |
Jun 16 2009 |
CompTake Technology Inc. |
Heat sink for read only memory device |
D657756, |
Oct 17 2011 |
Corsair Memory, Inc |
Low profile heat spreader for a computer memory module |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a