Patent
   D689829
Priority
Jan 02 2013
Filed
Jan 02 2013
Issued
Sep 17 2013
Expiry
Sep 17 2027
Assg.orig
Entity
unknown
17
17
n/a
The ornamental design for a heat dissipating module of memory, as shown and described.

FIG. 1 is a perspective view of a heat dissipating module of memory showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof; and

FIG. 8 is the other perspective view showing the heat dissipating module of memory; and,

FIG. 9 is a perspective view of the heat dissipating module of memory for reference.

The broken lines shown represent unclaimed subject matter and form no part of the claimed design.

Chen, Hsin-An, Chen, Wei-Hau, Ku, Chia-Yuan, Chen, Li-Hsu

Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 25 2012CHEN, WEI-HAUCOMPTAKE TECHNOLOGY INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0295550199 pdf
Dec 25 2012KU, CHIA-YUANCOMPTAKE TECHNOLOGY INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0295550199 pdf
Dec 25 2012CHEN, LI-HSUCOMPTAKE TECHNOLOGY INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0295550199 pdf
Dec 25 2012CHEN, HSIN-ANCOMPTAKE TECHNOLOGY INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0295550199 pdf
Jan 02 2013CompTake Technology Inc.(assignment on the face of the patent)
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