Heat sink for memory module

Abstract

Description

FIG. 1 is a perspective view of a heat sink for memory module showing the claimed design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is an enlarged fragment view of the portion of the heat sink for memory module indicated by encircled region “A” of FIG. 2;

FIG. 10 is an enlarged fragment view of the portion of the heat sink for memory module indicated by encircled region “B” of FIG. 2;

FIG. 11 is an exemplary perspective view showing the heat sink for memory module in use; and,

FIG. 12 is another exemplary perspective view showing the heat sink for memory module in use.

The broken lines in FIG. 2 are employed merely to indicate which portions of the heat sink are shown in enlargement in FIGS. 9 and 10, and form no part of the claimed design.

The illustrative broken line showing of a card placed within the heat sink in FIGS. 11 and 12 depicts an exemplary component which might be used with the heat sink for memory module, and forms no part of the claimed design.

Claims

We claim the ornamental design for a heat sink for memory module, as shown and described.