Patent
   D659110
Priority
Mar 23 2010
Filed
Mar 23 2010
Issued
May 08 2012
Expiry
May 08 2026
Assg.orig
Entity
unknown
4
18
n/a
The ornamental design for an heat-dissipating device for memory, as shown and described.

FIG. 1 is a perspective view of a heat-dissipating device for memory showing my new design wherein a portion of the device is shown separately for ease of illustration;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is an exploded perspective view of the heat dissipating device thereof; and,

FIG. 9 is a perspective view of the heat dissipating, device thereof.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Chen, Wei-Hau, Kuo, Cheng-Hsien

Patent Priority Assignee Title
D688905, Apr 19 2013 BANKSUPPLIES, INC Shelf with lip
D707067, Sep 13 2013 L A DARLING COMPANY Adjustable shelf
D789718, Sep 02 2015 Heatcraft Refrigeration Products LLC Plastic shelf liner for merchandising display cases
D801094, Apr 15 2015 RICERCHE DI ARCHITETTURA LOGICA PER AMBIENTI DI GUIDO SARTORETTO VERNA - SOCIETÀ IN NOME COLLETTIVO Furniture shelf with front element
Patent Priority Assignee Title
6297966, Dec 24 1998 Foxconn Precision Components Co., Ltd. Memory module having improved heat dissipation and shielding
6672379, Jul 29 2002 Waffer Technology Corp.; Jack, Wang Positioning and buckling structure for use in a radiator
6765799, Mar 21 2003 GOLDEN SUN NEWS TECHNIQUES CO , LTD ; HUANG, JIN-ZONG Heat dissipating fins interlocking mechanism
6842342, Sep 12 2003 Leohab Enterprise Co., Ltd. Heat sink
7190595, Sep 22 2004 Protecting device of a memory module
7457122, Feb 22 2006 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Memory module assembly including a clip for mounting a heat sink thereon
7721790, Oct 31 2006 Foxconn Technology Co., Ltd. Heat sink
7733653, Dec 20 2008 Yuan Deng Metals Industrial Co. Ltd Heat radiating member mounting structure
20030026076,
20070084584,
20080011453,
20080179043,
20080264613,
20090294099,
20100038055,
D496006, Aug 16 2002 DATECH TECHNOLOGY CO , LTD Heat sink
D531965, Oct 28 2004 Mushkin, Inc. Memory card heat sink
D610557, Jun 16 2009 CompTake Technology Inc. Heat sink for read only memory device
///
Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 12 2010CHEN, WEI-HAUCOMPTAKE TECHNOLOGY INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0241250821 pdf
Mar 12 2010KUO, CHENG-HSIENCOMPTAKE TECHNOLOGY INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0241250821 pdf
Mar 23 2010ComTake Technology, Inc.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule