The ornamental design for an heat-dissipating device for memory, as shown and described.
FIG. 1 is a perspective view of a heat-dissipating device for memory showing my new design wherein a portion of the device is shown separately for ease of illustration;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is an exploded perspective view of the heat dissipating device thereof; and,
FIG. 9 is a perspective view of the heat dissipating, device thereof.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.