Heat releasing plate for mounting semiconductor components

Abstract

Description

FIG. 1 is a front view of the heat releasing plate for mounting semiconductor components showing the new design;

FIG. 2 is a plan view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof; and

FIG. 6 is a sectional view taken on line 6--6 of FIG. 2.

Claims

The ornamental design for a heat releasing plate for mounting semiconductor components, as shown and described.