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The ornamental design for a light-emitting diode semiconductor chip with leads, substantially as shown and described. |
FIG. 1 is a perspective view of a light-emitting diode semiconductor chip with leads showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a side elevational view thereof, as seen from the right side of FIG. 1;
FIG. 4 is a side elevational view thereof, as seen from the left side of FIG. 1;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective veiw of a light-emitting diode semiconductor chip with leads showing the second embodiment of my new design;
FIG. 8 is a front elevational view thereof;
FIG. 9 is a side elevational view thereof, as seen from the right side of FIG. 7;
FIG. 10 is a side elevational view thereof, as seen from the left side of FIG. 7;
FIG. 11 is a top plan view thereof; and
FIG. 12 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 21 1982 | TAKAHASHI, KAORU | STANLEY ELECRIC CO , LTD , A COMPANY OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 003998 | /0002 | |
Apr 28 1982 | Stanley Electric Co., Ltd. | (assignment on the face of the patent) | / |
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