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The ornamental design for a portable memory module, as shown and described. |
FIG. 1 is a top front and right side perspective view of a portable memory module showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof, the bottom view being a mirror image;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a top, front and right side perspective view of a second embodiment thereof;
FIG. 8 is a top, front, and right side perspective view of a third embodiment thereof;
FIG. 9 is a top, front, and right side perspective view of a fourth embodiment thereof;
FIG. 10 is a top, front, and right side perspective view of a fifth embodiment thereof; and
FIG. 11 is a top, front, and right side perspective view of a sixth embodiment thereof.
The undisclosed top, rear, and side views of the second through sixth embodiments are shown in FIGS. 3-6.
Davies, Jr., William F., Bolan, Michael L., Scherpenberg, Francis A.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 29 1985 | BOLAN, MICHAEL L | DALLAS SEMICONDUCTOR CORPORATION, 4350 BELTWOOD PARKWAY SOUTH, DALLAS, TEXAS 75244, A CORP OF DE | ASSIGNMENT OF ASSIGNORS INTEREST | 004477 | /0712 | |
Oct 29 1985 | SCHERPENBERG, FRANCIS A | DALLAS SEMICONDUCTOR CORPORATION, 4350 BELTWOOD PARKWAY SOUTH, DALLAS, TEXAS 75244, A CORP OF DE | ASSIGNMENT OF ASSIGNORS INTEREST | 004477 | /0712 | |
Oct 29 1985 | DAVIES, WILLIAM F JR | DALLAS SEMICONDUCTOR CORPORATION, 4350 BELTWOOD PARKWAY SOUTH, DALLAS, TEXAS 75244, A CORP OF DE | ASSIGNMENT OF ASSIGNORS INTEREST | 004477 | /0712 | |
Oct 30 1985 | Dallas Semiconductor Corporation | (assignment on the face of the patent) | / |
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