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The ornamental design for a data memory module, as shown. |
FIG. 1 is a front perspective view of a data memory module showing our new design;
FIG. 2 is a right side elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a front elevational view thereof:
FIG. 7 is a rear elevational view thereof.
Wang, James P., McDaniel, Robert F.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 23 1983 | MC DANIEL, ROBERT F | INTERNATIONAL BUSINESS MACHINES CORPORATION, A NY CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 004180 | /0228 | |
Sep 23 1983 | WANG, JAMES P | INTERNATIONAL BUSINESS MACHINES CORPORATION, A NY CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 004180 | /0228 | |
Sep 29 1983 | International Business Machines Corporation | (assignment on the face of the patent) | / | |||
Mar 26 1991 | International Business Machines Corporation | IBM INFORMATION PRODUCTS CORPORATION, 55 RAILROAD AVENUE, GREENWICH, CT 06830 A CORP OF DE | ASSIGNMENT OF ASSIGNORS INTEREST | 005678 | /0098 | |
Mar 27 1991 | IBM INFORMATION PRODUCTS CORPORATION | MORGAN BANK | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 005678 | /0062 |
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