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The ornamental design for a removable module for an electronic peripheral, as shown and described. |
FIG. 1 is an enlarged top front and right side perspective view of a removable module for an electronic peripheral showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a right side elevational view thereof the left side being identical in appearance;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a rear elevational view thereof.
The circular pattern is partially shown in the views for ease of illustration and it being understood to continue across the entire surface where indicated.
Lajara, Robert, Szaroletta, William K., Hileman, Vincent P.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 28 1990 | LAJARA, ROBERT | SUN MICROSYSTEMS, INC , A DE CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 005476 | /0733 | |
Sep 28 1990 | HILEMAN, VINCENT P | SUN MICROSYSTEMS, INC , A DE CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 005476 | /0733 | |
Sep 28 1990 | SZAROLETTA, WILLIAM K | SUN MICROSYSTEMS, INC , A DE CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 005476 | /0733 | |
Oct 10 1990 | Sun Microsystems, Inc. | (assignment on the face of the patent) | / |
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