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The ornamental design for a multi-pin socket, as shown and described. |
FIG. 1 is a front perspective view of a multi-pin socket showing my new design;
FIG. 2 is a front end elevational view thereof;
FIG. 3 is a rear end elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 25 1987 | KOMATSU, YASUHIRO | HOSIDEN ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 004768 | /0449 | |
Oct 13 1987 | Hosiden Electronics Co. Ltd. | (assignment on the face of the patent) | / |
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