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The ornamental design for a multi-pin socket, as shown and described. |
FIG. 1 is a perspective view of a multi-pin socket showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a perspective view of a multi-pin socket showing a second embodiment of my new design;
FIG. 9 is a front elevational view thereof;
FIG. 10 is a rear elevational view thereof;
FIG. 11 is a right elevational view thereof;
FIG. 12 is a left side elevational view thereof;
FIG. 13 is a top plan view thereof; and,
FIG. 14 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 06 1989 | SHIBANO, YASUJI | HOSIDEN ELECTRONICS CO , LTD , A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005019 | /0063 | |
Feb 21 1989 | Hosiden Electronics Co., Ltd. | (assignment on the face of the patent) | / |
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