|
The ornamental design for a headphone, as shown and described. |
FIG. 1 is a top, front and right-side perspective view of a headphone, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right-side elevational view thereof, the left-side being a mirror image thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 31 1990 | ISONAGA, YASUAKI | SONY CORPORATION, 7-35 KITASHINAGAWA-6, SHINAGAWA-KU, TOKYO, JAPAN A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005347 | /0612 | |
Jun 06 1990 | Sony Corporation | (assignment on the face of the patent) | / |
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