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The ornamental design for a headphone, as shown and described. |
FIG. 1 is a top, front, and right-side elevational view of a headphone, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is an enlarged cross-sectional view thereof taken through section lines 3--3 of FIG. 2;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right-side elevational view thereof, the left-side being a mirror image;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 29 1988 | Sony Corporation | (assignment on the face of the patent) | / | |||
May 19 1989 | Ichikawa, Kazuo | SONY CORPORATION, 7-35 KITASHINAGAWA-6, SHINAGAWA-KU, TOKYO, JAPAN, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005098 | /0487 |
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