Patent
   D316551
Priority
Jun 29 1988
Filed
Dec 29 1988
Issued
Apr 30 1991
Expiry
Apr 30 2005
Assg.orig
Entity
unknown
67
3
n/a
The ornamental design for a headphone, as shown and described.

FIG. 1 is a top, front, and right-side elevational view of a headphone, showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is an enlarged cross-sectional view thereof taken through section lines 3--3 of FIG. 2;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a right-side elevational view thereof, the left-side being a mirror image;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

Ichikawa, Kazuo

Patent Priority Assignee Title
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D696227, May 22 2012 SENNHEISER CONSUMER AUDIO GMBH Headphones
D706746, Dec 14 2012 Panasonic Corporation Headset
D707199, Feb 13 2013 Motorola Mobility LLC Audio interface
D714255, Aug 16 2013 Microsoft Corporation Headset
D717765, Nov 01 2013 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Communications headset
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D722041, Aug 16 2013 Microsoft Corporation Headset
D724562, Aug 16 2013 Microsoft Corporation Headset
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D735691, Aug 16 2013 Microsoft Corporation Earcups for a headset
D740785, Dec 18 2013 SHENZHEN SHOKZ CO , LTD Wireless bone conduction earphone
D748603, Dec 30 2014 ADVANCED ELECTRONIC AND MEDICAL INDUSTRIES COMPANY LIMITED Headset
D750593, Feb 08 2013 MUZIK INC Headphone
D763820, Mar 25 2015 Headphones
D790502, Jun 11 2015 SHENZHEN VOXTECH CO., LTD. Stereo bone conduction wireless headset
D791100, Jun 11 2015 SHENZHEN VOXTECH CO., LTD. Stereo bone conduction wireless headset
D794601, Feb 23 2016 Harman International Industries, Incorporated Earphone
D794602, Feb 23 2016 Harman International Industries, Incorporated Side portion of earphone
D794603, Feb 23 2016 Harman International Industries, Incorporated Earphone
D801301, Jun 27 2016 KAY TECHNOLOGIES, LLC Headphone
D823279, Apr 21 2016 SHENZHEN SHOKZ CO , LTD Bone conduction speaker
D830335, May 23 2017 SPIGEN KOREA CO , LTD Wireless headset
D840968, May 23 2017 SPIGEN KOREA CO , LTD Wireless headset
D842269, May 23 2017 SPIGEN KOREA CO , LTD Wireless headset
D851623, Dec 30 2016 SHENZHEN SHOKZ CO , LTD Bone conduction speaker
D875710, Sep 07 2018 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Communications headset or headphone
D877714, Sep 25 2018 Microsoft Corporation Headset
D878327, Sep 25 2018 Microsoft Corporation Earcups for a headset
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D942413, Nov 29 2019 LG Electronics Inc. Wireless neckband
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Patent Priority Assignee Title
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//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 29 1988Sony Corporation(assignment on the face of the patent)
May 19 1989Ichikawa, KazuoSONY CORPORATION, 7-35 KITASHINAGAWA-6, SHINAGAWA-KU, TOKYO, JAPAN, A CORP OF JAPANASSIGNMENT OF ASSIGNORS INTEREST 0050980487 pdf
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