|
The ornamental design for a headphone, as shown and described. |
FIG. 1 is a front elevational view of a headphone showing my new design;
FIG. 2 is a right-side elevational view thereof, the left side being a mirror image;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a perspective view thereof, showing the headband in the extended position; and,
FIG. 7 is a perspective view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 09 1991 | Sony Corporation | (assignment on the face of the patent) | / | |||
Aug 05 1991 | NAKAYAMA, TAKAO | SONY CORPORATION A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005832 | /0920 |
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