FIG. 1 is a perspective view of headphones showing our new design;
FIG. 2 is a side elevational view of one side thereof;
FIG. 3 is a side elevational view of the opposite side thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a top plan view thereof.
The broken line showings form no part of the claimed design.
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Jun 26 2015 | | Harman International Industries, Incorporated | (assignment on the face of the patent) | | / |