FIG. 1 is a perspective view of a headphone showing the new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a side elevational view thereof;
FIG. 5 is an opposite side elevational view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a perspective view of another embodiment of the headphone, illustrating a mirror image of the headphone of FIGS. 1-7;
FIG. 9 is a front elevational view thereof;
FIG. 10 is a rear elevational view thereof;
FIG. 11 is a side elevational view thereof;
FIG. 12 is an opposite side elevational view thereof;
FIG. 13 is a top view thereof; and,
FIG. 14 is a bottom view thereof.
The broken lines immediately adjacent the shaded areas represent the bounds of the claimed design, while all other broken lines are directed to environment and are for illustrative purposes only; the broken lines form no part of the claim design.
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May 09 2017 |
DROWSY DIGITAL, INC |
Earbud |
D831619, |
Sep 20 2016 |
Audio-Technica Corporation |
Earphone |
D838258, |
Jul 04 2016 |
1MORE INC.; 1MORE INC |
Earphone |
D838690, |
Jul 29 2016 |
LG Electronics Inc. |
Wireless speaker |
D838693, |
May 29 2017 |
|
Earphone |
D839238, |
Jul 02 2018 |
MPOW TECHNOLOGY CO., LIMITED |
Earphone |
D840972, |
Oct 20 2017 |
SHENZHEN SHENGLAN ELECTRONIC INDUSTRY CO., LTD. |
Earphone |
D845282, |
Dec 20 2016 |
Shenzhen Tomtop Technology Co., Ltd. |
In-ear sport headphone |
D845932, |
Aug 31 2017 |
Harman International Industries, Incorporated |
Headphone |
D848395, |
Aug 07 2017 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset |
D853351, |
Aug 28 2017 |
Harman International Industries, Incorporated |
Headphones |
D870711, |
Dec 28 2017 |
Harman International Industries, Incorporated |
Headphone |
D871374, |
Dec 28 2017 |
Harman International Industries, Incorporated |
Headphone |
EM4508870002, |
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|
EM27560310001, |
|
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|
EM40375880002, |
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