Patent
   D640976
Priority
Aug 28 2008
Filed
Aug 28 2008
Issued
Jul 05 2011
Expiry
Jul 05 2025
Assg.orig
Entity
unknown
56
165
n/a
The ornamental design for a support structure and/or cradle for a mobile computing device, as shown and described.

FIG. 1 is a front isometric view depicting a mating façade of a support structure and/or cradle for a mobile computing device, under a first embodiment;

FIG. 2 is a bottom isometric view of the support structure and/or cradle of FIG. 1;

FIG. 3 is a frontal view of the support structure and/or cradle of FIG. 1;

FIG. 4 is a rearward view of the support structure and/or cradle of FIG. 1;

FIG. 5 is a first side view of the support structure and/or cradle of FIG. 1;

FIG. 6 is a second side view of the support structure and/or cradle of FIG. 1;

FIG. 7 is a top view depicting the mating façade of the support structure and/or cradle;

FIG. 8 is a bottom view depicting of the support structure and/or cradle;

FIG. 9 is a front isometric view depicting a mating façade of a support structure and/or cradle for a mobile computing device having a notched body, under a second embodiment;

FIG. 10 is a side view of a portion of the body containing the notch, under the second embodiment; and,

FIG. 11 illustrates the support structure and/or cradle of the first or second embodiment, with a representative mobile computing device shown provided thereon in phantom to occupy any one of multiple possible positions, the mobile computing device being capable of being supported and/or being placed in communication to receive data and/or power from the support structure and/or cradle.

The broken-line showing of the power supply adapter in any figure is for illustrative purposes only and forms no part of the embodiment depicted.

Matsuoka, Yoshimichi

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Aug 28 2008Hewlett-Packard Development Company, L.P.(assignment on the face of the patent)
Aug 28 2008MATSUOKA, YOSHIMICHIPalm, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0214590419 pdf
Oct 02 2009Palm, IncJPMORGAN CHASE BANK, N A SECURITY AGREEMENT0234060671 pdf
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Jan 23 2014Hewlett-Packard CompanyQualcomm IncorporatedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0321320001 pdf
Jan 23 2014HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Qualcomm IncorporatedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0321320001 pdf
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