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The ornamental design for a headphone, as shown and described. |
FIG. 1 is a perspective view of a headphone showing my new design;
FIG. 2 is a right side elevational view thereof, the left view being a mirror image;
FIG. 3 is a top plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a rear elevational view thereof; and,
FIG. 7 is a perspective view thereof, the person and cord portions are shown in broken lines for illustrative purposes only and form no part of the claimed design.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 14 1995 | YOSHIZAWA, NANASE | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007413 | /0536 | |
Mar 23 1995 | Sony Corporation | (assignment on the face of the patent) | / |
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