FIG. 1 is a front perspective view of earcups for a headset showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is an additional front perspective view of the design showing one earcup in isolation for clarity purposes; and,
FIG. 9 is an additional right side view thereof.
The broken lines depicting the remainder of the earcups for a headset in FIGS. 1-9 show features that form no part of the claimed design.
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Microsoft Corporation |
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Aug 16 2013 |
Microsoft Corporation |
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Microsoft Corporation |
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Microsoft Corporation |
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Aug 16 2013 |
Microsoft Corporation |
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Aug 16 2013 |
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SHENZHEN INITIATIVE TECHNOLOGY CO , LTD |
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HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
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Feb 14 2017 |
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Communications headset or headphone |
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Oct 26 2016 |
MUZIK INC |
Interactive headphones |
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Oct 02 2017 |
SHENZHEN YUAN YUN TECHNOLOGY CO., LTD. |
Headphone |
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Aug 19 2016 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset or headphone |
D854513, |
Aug 28 2017 |
ALPHATHETA CORPORATION |
Headphone |
D857652, |
Dec 08 2017 |
SHENGYUAN SCIENCE AND TECHNOLOGY SHENZHEN CO , LTD |
Headset |
D861636, |
Apr 06 2018 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset or headphone |
EM67784860001, |
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