Patent
   D696644
Priority
Sep 19 2012
Filed
Sep 19 2012
Issued
Dec 31 2013
Expiry
Dec 31 2027
Assg.orig
Entity
unknown
49
28
n/a
The ornamental design for headphones, as shown and described.

FIG. 1 is a perspective view of headphones showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a perspective view of a second embodiment of headphones showing my new design;

FIG. 6 is a front elevational view thereof;

FIG. 7 is a side elevational view thereof;

FIG. 8 is a top plan view thereof;

FIG. 9 is a perspective view of a third embodiment of headphones showing my new design;

FIG. 10 is a front elevational view thereof;

FIG. 11 is a side elevational view thereof; and,

FIG. 12 is a top plan view thereof.

Sejpka, Markus

Patent Priority Assignee Title
11700474, Jun 24 2021 NEW AUDIO LLC Multi-microphone headset
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D734297, Apr 23 2014 JVC Kenwood Corporation Headphone
D762190, Feb 10 2014 NEW AUDIO LLC Ear cover backing portion of a headphone device
D763223, Jun 02 2014 AKC ACOUSTICS GMBH; AKG Acoustics GmbH Headphone
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D805056, Feb 10 2014 NEW AUDIO LLC Adjustment portion of headphone device
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D811364, Aug 31 2016 Harman International Industries, Incorporated Headphone
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D852164, Sep 29 2017 SHENZHEN MEIDONG ACOUSTICS CO , LTD Headset
D852166, Feb 10 2014 NEW AUDIO LLC Earpad and backing portions of headphone device
D852168, Mar 26 2019 Headset
D852777, Aug 31 2016 Harman International Industries, Incorporated Headphone
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D877114, Dec 28 2017 Harman International Industries, Incorporated Headphone
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Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 19 2012Harman International Industries, Incorporated(assignment on the face of the patent)
Nov 19 2012SEJPKA, MARKUSHarman International Industries, IncorporatedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0294190292 pdf
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