Patent
   D892078
Priority
Aug 27 2018
Filed
Aug 27 2018
Issued
Aug 04 2020
Expiry
Aug 04 2035
Assg.orig
Entity
unknown
24
34
n/a
The ornamental design for a headphone, as shown and described.

FIG. 1 is a perspective view of a headphone showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is an opposite side elevational view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a top perspective view thereof;

FIG. 9 is a bottom perspective view thereof;

FIG. 10 is a perspective view of another embodiment of the headphone showing the new design;

FIG. 11 is a front elevational view thereof;

FIG. 12 is a rear elevational view thereof;

FIG. 13 is a side elevational view thereof;

FIG. 14 is an opposite side elevational view thereof;

FIG. 15 is a top view thereof; and,

FIG. 16 is a bottom view thereof.

The broken lines immediately adjacent the shaded areas represent the bounds of the claimed design while all other broken lines are directed to environment and are for illustrative purposes only; the broken lines form no part of the claimed design.

He, Yanyao

Patent Priority Assignee Title
D905004, Aug 28 2015 Sony Corporation Headphone
D907003, Jun 21 2019 Headset
D907598, Mar 08 2019 Shenzhen MeiDong Acoustics Co., Ltd.; SHENZHEN MEIDONG ACOUSTICS CO ,LTD Headphone
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D917420, Jul 25 2019 Audio headset
D918171, Aug 28 2015 Sony Corporation Headphone
D923600, Aug 15 2019 Sony Corporation Headphone
D929958, Dec 20 2019 Yamaha Corporation Headphone
D936631, Dec 30 2019 Shenzhen Aukey Smart Information Technology Co., Ltd.; SHENZHEN AUKEY SMART INFORMATION TECHNOLOGY CO , LTD Headphone
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//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 27 2018Harman International Industries, Incorporated(assignment on the face of the patent)
Sep 29 2018HE, YANYAOHarman International Industries, IncorporatedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0470820670 pdf
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