|
The ornamental design for a headphone, as shown and described. |
FIG. 1 is a top, front and right-side perspective view of a headphone, showing our new design;
FIG. 2 is a top, front and right-side perspective view thereof, shown with head band in the expanded position;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right-side elevational view thereof, the left-side being a mirror image;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Yamazaki, Akira, Miyashita, Ohshi
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Patent | Priority | Assignee | Title |
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 07 1991 | Sony Corporation | (assignment on the face of the patent) | / | |||
Mar 29 1991 | YAMAZAKI, AKIRA | SONY CORPORATION, 7-35 KITASHINAGAWA-6, SHINAGAWA-KU, TOKYO, JAPAN, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005679 | /0310 | |
Mar 29 1991 | MIYASHITA, OHSHI | SONY CORPORATION, 7-35 KITASHINAGAWA-6, SHINAGAWA-KU, TOKYO, JAPAN, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005679 | /0310 |
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