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The ornamental design for an earpiece and headband for a communications headset, as shown and described.
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FIG. 1 is an upper left front perspective view of earpiece and headband for a communication headset showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The ornamental design that is claimed is shown in solid lines in the drawings. The broken line outline of a headset microphone boom is shown in the drawings for environmental purposes only, and forms no part of the claimed design.
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Dec 14 2005 | SKULLEY, GERALD W | Plantronics, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 017401 | /0073 | |
Dec 19 2005 | Plantronics, Inc. | (assignment on the face of the patent) | / | |||
Jul 02 2018 | Plantronics, Inc | Wells Fargo Bank, National Association | SECURITY AGREEMENT | 046491 | /0915 | |
Jul 02 2018 | Polycom, Inc | Wells Fargo Bank, National Association | SECURITY AGREEMENT | 046491 | /0915 | |
Aug 29 2022 | Wells Fargo Bank, National Association | Plantronics, Inc | RELEASE OF PATENT SECURITY INTERESTS | 061356 | /0366 | |
Aug 29 2022 | Wells Fargo Bank, National Association | Polycom, Inc | RELEASE OF PATENT SECURITY INTERESTS | 061356 | /0366 |
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