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The ornamental design for a headphone, as shown. |
FIG. 1 is an enlarged top, front, and right-side perspective view of a headphone, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left-side elevational view thereof;
FIG. 5 is a right-side elevational view thereof;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 28 1988 | KATO, KAZUE | SONY CORPORATION, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 004981 | /0727 | |
Nov 30 1988 | YODA, SHINGO | SONY CORPORATION, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 004981 | /0727 | |
Dec 07 1988 | Sony Corporation | (assignment on the face of the patent) | / |
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