FIG. 1 is a front, right, and top perspective view of a headset, showing my design.
FIG. 2 is a rear, left, and bottom perspective view thereof.
FIG. 3 is a front elevation view thereof.
FIG. 4 is a rear elevation view thereof.
FIG. 5 is a left side elevation view thereof.
FIG. 6 is a right side elevation view thereof.
FIG. 7 is a top plan view thereof.
FIG. 8 is a bottom plan view thereof; and,
FIG. 9 is a partial enlarged view of an area labeled 9 in FIG. 1 comprising a right part.
The dot dash broken lines encircling portions of the headset in FIG. 1 and illustrated in the enlarged view of FIG. 9 form no part of the claimed design.
The broken lines shown in the drawings are included for the purpose of illustrating portions of the headset that form no part of the claimed design.
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Headset |
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Headset |
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HMD Global Oy |
Headset |
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Bluetooth headset |
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Apple Inc |
Headphone |
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Communication headset |
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Headphone |
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Headphone |
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SKULLCANDY, INC |
Headset |
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Apr 24 2012 |
Datastore Technology Corp. |
Headset |
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Feb 18 2013 |
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Headphones |
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Nov 22 2011 |
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Headphones |
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Headphones |
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Jun 12 2014 |
AsusTek Computer Inc. |
Headset |
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Headset |
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Headset with microphone |
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Headphones |
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Headset |
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Feb 10 2014 |
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Ear-cover backing portion of headphone device |
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Mar 15 2016 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Headset |
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Jul 23 2015 |
LOGITECH EUROPE, S.A. |
Headset with microphone |
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Jun 02 2016 |
Zound Industries International AB |
Foldable headphone |
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NEW AUDIO LLC |
Headset |
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Jul 19 2017 |
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Headset |
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SHENZHEN AONI ELECTRONIC CO , LTD |
Headset |
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Dec 10 2015 |
SKULLCANDY, INC |
Headphone |
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Mar 27 2017 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Headset |
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Sep 29 2017 |
SHENZHEN MEIDONG ACOUSTICS CO , LTD |
Headset |
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Aug 01 2017 |
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Gaming headset |
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Oct 20 2017 |
GUANGDONG KOTION ELECTROACOUSTIC TECHNOLOGY CO , LTD |
Earphone |
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Oct 20 2017 |
GUANGDONG KOTION ELECTROACOUSTIC TECHNOLOGY CO , LTD |
Earphone |
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EPOS GROUP A S |
Headset with adjustable contact pressure (ACP) including a spring system |
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Jan 15 2018 |
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Gaming headset |
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Gaming headset |
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Oct 03 2017 |
Audio-Technica Corporation |
Headphone |
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Aug 01 2018 |
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Headphone |
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Nov 13 2019 |
SHENZHEN QIANHAI PATUOXUN NETWORK AND TECHNOLOGY CO., LTD |
Headphone |
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Aug 27 2018 |
Harman International Industries, Incorporated |
Headphone |
D889402, |
May 23 2019 |
ESI Cases & Accessories |
Charging cradle for wireless earpiece case |
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Jan 03 2019 |
Yizhao Digital Technology (Shenzhen) Co., Ltd; YIZHAO DIGITAL TECHNOLOGY SHENZHEN CO , LTD |
Headphone |
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May 11 2020 |
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Headphone |
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May 11 2020 |
SHENZHEN QIANHAI PATUOXUN NETWORK AND TECHNOLOGY CO., LTD |
Headphones |
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Jan 05 2018 |
Zound Industries International AB |
Headphone |
D908110, |
Apr 16 2019 |
ZHONGTIAN DINGSHENG SHENZHEN INDUSTRY CO , LTD |
Headphone |
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Dec 07 2018 |
Audio-Technica Corporation |
Headphone |
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Jun 24 2019 |
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Headset |
D916681, |
Aug 06 2020 |
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Headset |
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Apr 07 2017 |
New Audio, LLC |
Headset |
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Oct 29 2018 |
Bose Corporation |
Headset |
D931831, |
Dec 23 2019 |
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Headset |
D935400, |
Apr 10 2020 |
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Multi-function charger |
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Dec 24 2019 |
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Gaming headphone |
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Dec 24 2019 |
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Gaming headphone |
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Apr 10 2020 |
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Headset |
D940100, |
May 16 2020 |
DONGGUAN LANYE ELECTRONIC TECHNOLOGY CO., LTD. |
Headset |
D941802, |
Mar 31 2020 |
SHENZHEN YONGSHENG ELECTRONIC TECHNOLOGY CO., LTD. |
Headset |
D941803, |
Mar 31 2020 |
SHENZHEN YONGSHENG ELECTRONIC TECHNOLOGY CO., LTD. |
Headset |
D945394, |
Dec 18 2020 |
SHENZHEN QIANHAI PATUOXUN NETWORK AND TECHNOLOGY CO., LTD |
Headphone |
D947810, |
Oct 18 2020 |
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Headset |
D947811, |
Oct 18 2020 |
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Headset |
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Jun 27 2020 |
GUANGDONG KOTION ELECTROACOUSTIC TECHNOLOGY CO ,LTD |
Earphone |
D951909, |
Jul 06 2020 |
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Headset |
D952601, |
Jul 31 2020 |
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Headphone |
D953292, |
Jun 07 2021 |
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Headset |
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Dec 14 2020 |
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.; PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO , LTD |
Headphone |
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