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Patent
D592182
Priority
Aug 27 2007
Filed
Feb 26 2008
Issued
May 12 2009
Expiry
May 12 2023
Assg.orig
Entity
unknown
98
22
n/a
The ornamental design for a headset, as shown and described.
FIG. 1 is a right perspective view of a headset showing my new design;
FIG. 2 is a left perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a top view thereof; and,
FIG. 5 is a bottom view thereof.
The broken line showing environmental structure or surface ornamentations is for illustrative purposes only and forms no part of the claimed design.
Sanguinetti, Alejandro
Patent
Priority
Assignee
Title
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ER4397 ,
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ER6875 ,
ER7529 ,
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ER9905 ,
Patent
Priority
Assignee
Title
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Collapsible headphone structure
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Aug 30 1984
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Sony Corporation
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Sony Corporation
Ear piece for a headphone
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Jul 12 2005
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Sony Corporation
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Bose Corporation
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Aug 16 2005
Sony Corporation
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SAMSUNG ELECTRONICS CO , LTD
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Jan 03 2006
Bose Corporation
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Dec 30 2005
WI-GEAR INC
Wireless headphone
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May 15 2007
Altec Lansing, LLC
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Aug 29 2006
Victor Company of Japan, Limited
Headphones
Date
Maintenance Fee Events
n/a
Date
Maintenance Schedule
n/a