FIG. 1 is a front elevational view of a headphone showing my new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view thereof in a folded position; and,
FIG. 8 is another perspective thereof, the opposite interior surface of the ear cup is a mirror image.
Leung, Chun Fai
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//
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 14 2011 | | P.S.L. Limited | (assignment on the face of the patent) | | |
Jun 14 2011 | LEUNG, CHUN FAI | P S L LIMITED | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 026436 | 0952 |
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