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The ornamental design for a headphone, as shown and described. |
FIG. 1 is a top, front and right-side perspective view of a headphone, showing my new design;
FIG. 2 is a top, front and right-side perspective view thereof, shown with head band in the expanded position;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right-side elevational view thereof, the left-side being a mirror image;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Patent | Priority | Assignee | Title |
5095382, | Mar 20 1989 | Sony Corporation | Wireless headphone |
D286772, | May 21 1984 | Headset for bio-electronic equipment | |
D291198, | Aug 30 1984 | Nippon Gakki Seizo Kabushiki Kaisha | Headphone |
D297324, | Jul 25 1984 | Sony Corporation | Headphone |
D300133, | Jan 30 1985 | Sony Corporation | Headphone |
D305541, | Apr 22 1987 | Sharp Corporation | Headphone |
D310081, | Jan 26 1988 | Sony Corporation | Headphone |
D316861, | Jun 14 1988 | Sony Corporation | Headphone |
D319241, | Apr 14 1989 | Sony Corporation | Headphone |
D323167, | Jun 14 1988 | Sony Corporation | Headphone |
D328074, | Aug 07 1990 | SONY CORPORATION, 7-35 KITASHINAGAWA-6, SHINAGAWA-KU, TOKYO, JAPAN, A CORP OF JAPAN | Headphone |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 17 1992 | YAMATOGI, KATSUMI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 006324 | /0486 | |
Oct 13 1992 | Sony Corporation | (assignment on the face of the patent) | / |
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