FIG. 1 is a perspective view of a first embodiment of a headphone showing
our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a rear elevational view thereof;
FIG. 8 is a perspective view of a second embodiment of a headphone showing
our new design;
FIG. 9 is a top plan view thereof;
FIG. 10 is a left side elevational view thereof;
FIG. 11 is a front elevational view thereof;
FIG. 12 is a bottom plan view thereof;
FIG. 13 is a right side elevational view thereof;
FIG. 14 is a rear elevational view thereof; and,
FIG. 15 is a perspective view thereof, in the folded condition.
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Feb 24 1999 |
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Headphone |
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Aug 23 1999 |
Sony Corporation |
Headphone |
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Jun 29 2001 |
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Headphone |
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Mar 21 2001 |
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Communications headset |
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Mar 21 2001 |
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Communications headset |
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Mar 21 2001 |
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Communications headset |
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Mar 21 2001 |
Plantronics, Inc |
Communications headset |
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Sep 05 2003 |
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Headphone |
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Aug 30 2004 |
Sony Corporation |
Headphone |
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Earphone |
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Communications headset |
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Aug 26 2008 |
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Headphone |
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Sep 02 2011 |
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Headphones |
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Headset |
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Jun 03 2015 |
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Gaming headset |
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Portable air conditioner |
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Jun 03 2015 |
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May 20 2016 |
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Headphone |
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Aug 31 2016 |
Harman International Industries, Incorporated |
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HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset or headphone |
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Communications headset or headphone |
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Headset |
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Aug 31 2016 |
Harman International Industries, Incorporated |
Headphone |
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Headphones |
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Headphones |
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Aug 09 2018 |
SHENZHEN GRANDSUN ELECTRONIC CO., LTD. |
Headphone |
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Jan 05 2018 |
SHENZHEN GRANDSUN ELECTRONIC CO., LTD. |
Headphone |
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Dec 28 2017 |
Harman International Industries, Incorporated |
Headphone |
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Nov 30 2018 |
GN AUDIO A S |
Headset |
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May 11 2020 |
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Headphone |
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Sep 04 2020 |
Liujia, Liu |
Headset |
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Nov 30 2018 |
GN AUDIO A/S |
Headset |
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Jan 03 2020 |
Harman International Industries, Incorporated |
Headphone |