FIG. 1 is a front perspective view of a headset showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a front side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines shown in the drawings are for illustrative purposes only and form no part of the claimed design.
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Headset including an earhook |
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Feb 20 2017 |
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HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset |
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Jun 06 2018 |
GN AUDIO A S |
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Headset for telephone and communication equipment |
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Jun 06 2018 |
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Headset for telephone and communication equipment |
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HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset |
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GN AUDIO A/S |
Headband bracket for a headset for telephone and communication equipment |
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Jun 06 2018 |
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Headset for telephone and communication equipment |
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HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset or headphone |
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Sep 13 2019 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
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Mar 21 2018 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Microphone boom for a communications headset |
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Mar 27 2020 |
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Mar 27 2020 |
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Mar 27 2020 |
YEALINK (XIAMEN) NETWORK TECHNOLOGY CO., LTD. |
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Jul 31 2020 |
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May 01 2020 |
RTX A S |
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Feb 05 2021 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
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HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
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May 26 2021 |
YI ZHAO (SHENZHEN) CO., LIMITED |
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Dec 19 2019 |
GN AUDIO A/S |
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May 26 2021 |
Anker Innovations Technology Co., Ltd. |
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Apr 14 2021 |
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