|
The ornamental design for a combined headphone and microphone, as shown and described. |
FIG. 1 is a front elevational view of a combined headphone and microphone showing my new design;
FIG. 2 is a right-side elevational view thereof;
FIG. 3 is a left-side elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a perspective view thereof; and,
FIG. 7 is a perspective view thereof, with the microphone in a use position, the broken line showing is for illustrative purposes and forms no part of the claimed design.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 31 1991 | Sony Corporation | (assignment on the face of the patent) | / | |||
Feb 04 1992 | HATTORI, NAOFUMI | SONY CORPORATION, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 006017 | /0973 |
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