Patent
   D826208
Priority
Aug 31 2016
Filed
Feb 10 2017
Issued
Aug 21 2018
Expiry
Aug 21 2033
Assg.orig
Entity
unknown
28
88
n/a
The ornamental design for a headphone, as shown and described.

FIG. 1 is a perspective view of a headphone showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view of one side thereof;

FIG. 5 is a side elevational view of the opposite side thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is another perspective view thereof; and,

FIG. 9 is another perspective view thereof, in a folded configuration.

The broken lines and unshaded areas form no part of the claimed design.

Czaniecki, Rafal

Patent Priority Assignee Title
11700474, Jun 24 2021 NEW AUDIO LLC Multi-microphone headset
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D877114, Dec 28 2017 Harman International Industries, Incorporated Headphone
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D900782, Jan 03 2019 Harman International Industries, Incorporated Headphone
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D909991, Aug 28 2015 Sony Corporation Headphone
D915346, Aug 27 2019 Harman International Industries, Incorporated Headphone
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D928117, Aug 07 2015 New Audio, LLC Headset
D940686, Sep 13 2019 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Communications headset
D941273, Aug 27 2019 Harman International Industries, Incorporated Headphone
D942970, Aug 27 2019 Harman International Industries, Incorporated Headphone
D944759, Dec 27 2019 Harman International Industries, Incorporated Headphone
D944760, Jan 02 2020 Harman International Industries, Incorporated Headphone
D944761, Jan 02 2020 Harman International Industries, Incorporated Headphone
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D964312, Sep 15 2020 SHENZHEN 1MII TECHNOLOGIES LIMITED Headphone
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D980186, May 26 2021 YI ZHAO (SHENZHEN) CO., LIMITED Audio headset
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//
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Feb 10 2017Harman International Industries, Incorporated(assignment on the face of the patent)
Sep 08 2017CZANIECKI, RAFALHarman International Industries, IncorporatedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0436040279 pdf
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