FIG. 1 is a top, front and right side isometric view of a headphone or
similar article showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof, as seen along line 3--3 of
FIG. 2;
FIG. 4 is a top plan view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a rear elevational view thereof; and
FIG. 7 is a bottom plan view thereof.
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Priority |
Assignee |
Title |
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Jun 24 2021 |
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May 06 1999 |
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Mar 29 1990 |
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Dec 20 1990 |
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Jun 05 1991 |
SONY CORPORATION A CORPORATION OF JAPAN |
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Jun 06 1991 |
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Headphone |
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Jun 05 1991 |
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Feb 18 1997 |
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Dec 18 1997 |
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Jul 02 1998 |
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Jan 07 2009 |
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Dec 01 2008 |
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Aug 06 2008 |
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May 04 2010 |
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Aug 02 2010 |
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Dec 16 2010 |
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Aug 31 2011 |
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Dec 19 2011 |
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Monster, LLC |
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Jan 09 2012 |
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Sep 13 2011 |
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May 22 2012 |
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Aug 28 2012 |
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May 02 2013 |
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Aug 13 2013 |
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Nov 19 2013 |
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Nov 15 2013 |
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Aug 25 2014 |
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Jul 03 2014 |
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Nov 13 2015 |
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Jul 24 2015 |
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Jan 27 2016 |
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Mar 17 2016 |
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May 11 2016 |
KENU, INC. |
Headphone |
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May 16 2016 |
KENU, INC. |
Headphone |
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Aug 19 2016 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset or headphone |
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Dec 01 2016 |
Zound Industries International AB |
Foldable headphone |
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Aug 02 2016 |
AUDIO-TECHNICA COPRORATION |
Headphone |
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Aug 02 2016 |
AUDIO TECHNICA CORPORATION |
Headphone |
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Jul 23 2015 |
LOGITECH EUROPE, S.A. |
Headset with microphone |
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Mar 28 2017 |
Dell Products L.P.; Dell Products L P |
Headset |
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Aug 31 2016 |
Harman International Industries, Incorporated |
Headphone |
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Aug 02 2016 |
Audio-Technica Corporation |
Headphone |
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Jun 02 2016 |
Zound Industries International AB |
Foldable headphone |
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Jun 02 2016 |
Zound Industries International AB |
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Headset |
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Aug 21 2017 |
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Aug 19 2016 |
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Oct 10 2018 |
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Nov 02 2017 |
Honeywell International Inc. |
Noise monitoring headset |
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Aug 26 2015 |
SENNHEISER ELECTRONIC GMBH & CO KG |
Headphones |
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Jan 31 2019 |
SHENZHEN QIANHAI PATUOXUN NETWORK AND TECHNOLOGY CO., LTD |
Headphone |
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Mar 02 2016 |
Dolby Laboratories Licensing Corporation |
Headphones |
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Feb 27 2018 |
Hewlett-Packard Development Company, L.P. |
Headset |
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Mar 02 2016 |
Dolby Laboratories Licensing Corporation |
Headphones |
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Jul 15 2019 |
SHENZHEN QIANHAI PATUOXUN NETWORK AND TECHNOLOGY CO., LTD |
Headphone |
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Dec 12 2017 |
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Headphone |
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May 11 2018 |
Techcool Industry Development Co., Ltd.; TECHCOOL INDUSTRY DEVELOPMENT CO , LTD |
Headset |
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May 18 2018 |
Gentex Corporation |
Headset |
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Jun 13 2017 |
Razer (Asia-Pacific) Pte. Ltd. |
Headset |
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Nov 23 2017 |
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Wireless headphone |
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May 11 2017 |
Zound Industries International AB |
Headphone |
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Aug 31 2018 |
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HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset or headphone |
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Aug 21 2018 |
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Headphone |
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Audio-Technica Corporation |
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Feb 10 2014 |
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Headband portion of headphone device |
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Jan 09 2018 |
Zound Industries International AB |
Headphone |
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Mar 02 2016 |
Dolby Laboratories Licensing Corporation |
Headphones |
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Zound Industries International AB |
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Aug 30 2019 |
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Communications headset |
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Mar 02 2016 |
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Dec 23 2019 |
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Dec 03 2019 |
Dolby Laboratories Licensing Corporation |
Headphones |
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Jan 21 2020 |
3M Innovative Properties Company |
Headset |
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May 25 2021 |
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Headset |
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Dec 11 2020 |
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Kid wireless headphones |
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Jun 22 2020 |
Apple Inc. |
Component for a headphone |
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Sep 18 2021 |
SHENZHEN RIYO INNOVATION TECHNOLOGY CO , LTD |
Headphone |
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Apr 15 2021 |
SHENZHEN DIYIN ELECTRONICS CO., LTD. |
Headset |
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Jan 21 2020 |
3M Innovative Properties Company |
Headset |
| ER1393, |
|
|
|
| ER1706, |
|
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|
| ER2026, |
|
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|
| ER2285, |
|
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| ER3096, |
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| ER373, |
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| ER3838, |
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| ER5562, |
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| ER8225, |
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