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The ornamental design for a headphone, as shown and described. |
FIG. 1 is a top plan view of a headphone, showing our new design;
FIG. 2 is a left-side elevational view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a right-side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a perspective view thereof.
Yamazaki, Akira, Iribe, Toshio, Gotoh, Hidefumi
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 25 1991 | Sony Corporation | (assignment on the face of the patent) | / | |||
Jan 16 1992 | YAMAZAKI, AKIRA | SONY CORPORATION A CORPORATION OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005990 | /0426 | |
Jan 16 1992 | IRIBE, TOSHIO | SONY CORPORATION A CORPORATION OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005990 | /0426 | |
Jan 16 1992 | GOTOH, HIDEFUMI | SONY CORPORATION A CORPORATION OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005990 | /0426 |
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