Patent
   D878328
Priority
Apr 06 2018
Filed
Oct 05 2018
Issued
Mar 17 2020
Expiry
Mar 17 2035
Assg.orig
Entity
unknown
5
47
n/a
The ornamental design for a headphone, as shown and described.

FIG. 1 is a front side perspective view of a headphone;

FIG. 2 is a rear side perspective view of the headphone;

FIG. 3 is a front elevational view of the headphone;

FIG. 4 is a rear elevational view of the headphone;

FIG. 5 is a top plan view of the headphone;

FIG. 6 is a bottom plan view of the headphone;

FIG. 7 is a left side elevational view of the headphone; and,

FIG. 8 is a right side elevational view of the headphone.

Portions of the drawings shown in broken lines form no part of the claimed design.

Araki, Shohei, Tsubone, Kodai

Patent Priority Assignee Title
D897986, Jun 18 2020 Dual fidelity headphone
D923599, Jul 25 2019 Audio headset
D935433, Nov 01 2019 Harman International Industries, Incorporated Headphone
D941273, Aug 27 2019 Harman International Industries, Incorporated Headphone
D984409, Mar 29 2021 Logitech Europe S.A.; LOGITECH EUROPE S A Headset
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 07 2018ARAKI, SHOHEIAudio-Technica CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0470790248 pdf
Aug 31 2018TSUBONE, KODAIAudio-Technica CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0470790248 pdf
Oct 05 2018Audio-Technica Corporation(assignment on the face of the patent)
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