FIG. 1.1 is an isometric view of the pair of headphones in accordance with a first embodiment of the invention.
FIG. 1.2 is a left side view of the a pair of headphones in accordance with a first embodiment of the invention.
FIG. 1.3 is a right side view of the a pair of headphones in accordance with a first embodiment of the invention.
FIG. 1.4 is a top side view of the a pair of headphones in accordance with a first embodiment of the invention.
FIG. 1.5 is a bottom side view of the a pair of headphones in accordance with a first embodiment of the invention.
FIG. 1.6 is a front view of the a pair of headphones in accordance with a first embodiment of the invention.
FIG. 1.7 is a rear view of the a pair of headphones in accordance with a first embodiment of the invention.
FIG. 2.1 is an isometric view of the a pair of headphones in accordance with a second embodiment of the invention.
FIG. 2.2 is a left side view of the a pair of headphones in accordance with a second embodiment of the invention.
FIG. 2.3 is a right side view of the a pair of headphones in accordance with a second embodiment of the invention.
FIG. 2.4 is a top side view of the a pair of headphones in accordance with a second embodiment of the invention.
FIG. 2.5 is a bottom side view of the a pair of headphones in accordance with a second embodiment of the invention; and,
FIG. 2.6 is a front view of the a pair of headphones in accordance with a second embodiment of the invention.
The broken lines shown in the figures are for the purpose of illustrating structure that forms no part of the claimed design.
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Priority |
Assignee |
Title |
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Apr 03 2017 |
Logitech Europe S.A. |
Headphones |
| D826897, |
Apr 27 2017 |
|
Headphone |
| D843349, |
Jun 05 2017 |
LOGITECH EUROPE, S A |
Headphone |
| D848395, |
Aug 07 2017 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset |
| D851622, |
Mar 30 2017 |
AKG Acoustics GmbH |
Headphone |
| D853985, |
Aug 29 2013 |
Sony Corporation |
Headphone |
| D864898, |
Apr 18 2018 |
|
Noise isolating headphone |
| D864899, |
May 11 2018 |
Techcool Industry Development Co., Ltd.; TECHCOOL INDUSTRY DEVELOPMENT CO , LTD |
Headset |
| D870066, |
Nov 27 2017 |
URBANISTA AB |
Headphones |
| D877115, |
Sep 13 2018 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset |
| D877717, |
Jun 08 2018 |
DREAMGEAR, LLC |
Venting headphones |
| D878328, |
Apr 06 2018 |
Audio-Technica Corporation |
Headphone |
| D878331, |
Apr 06 2018 |
Audio-Technica Corporation |
Headset |
| D878332, |
Apr 06 2018 |
Audio-Technica Corporation |
Headset |
| D881843, |
Dec 23 2019 |
SHENZHEN QIANHAI PATUOXUN NETWORK AND TECHNOLOGY CO., LTD |
Headphones |
| D882544, |
Mar 21 2018 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset |
| D895570, |
Nov 01 2018 |
Logitech Europe S.A. |
Audio headset |
| D896782, |
Mar 07 2019 |
SHENZHEN QIANHAI JUNLIAN NETWORK TECHNOLOGY CO., LTD.; SHENZHEN QIANHAI JUNLIAN NETWORK TECHNOLOGY CO , LTD |
Headphone |
| D923599, |
Jul 25 2019 |
|
Audio headset |
| D927456, |
Mar 21 2018 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Microphone boom for a communications headset |
| D935433, |
Nov 01 2019 |
Harman International Industries, Incorporated |
Headphone |
| D948471, |
Aug 12 2019 |
Acer Incorporated |
Headphone |
| D961548, |
Aug 10 2021 |
SHENZHEN RIYO INNOVATION TECHNOLOGY CO , LTD |
Headphone |
| ER1515, |
|
|
|
| ER1538, |
|
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|
| ER3118, |
|
|
|
| ER4553, |
|
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| ER4664, |
|
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| ER6079, |
|
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