FIG. 1 is a perspective view of an embodiment of a headset, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a disassembled or an exploded view thereof showing the covers separate from the body of the headset.
Broken lines are for illustrating portions of the headset which form no part of the claimed design.
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Headphone |
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Headphone |
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Oct 27 2017 |
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Pair of ear muffs |
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Battery compartment locking mechanism |
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Headset with adjustable contact pressure (ACP) including a spring system |
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Jul 15 2019 |
SHENZHEN QIANHAI PATUOXUN NETWORK AND TECHNOLOGY CO., LTD |
Headphone |
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Jun 13 2017 |
Razer (Asia-Pacific) Pte. Ltd. |
Headset |
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Aug 08 2018 |
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Earphone |
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Oct 31 2018 |
Dongguan City YongSheng electronics CO., LTD. |
Earphone |
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Dec 10 2018 |
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Feb 27 2018 |
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Headset |
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Headphone |
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Jul 31 2020 |
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Headset |
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Nov 25 2019 |
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Sep 26 2020 |
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Passive shooting earmuffs |
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Earphone |
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Dec 30 2019 |
SHENZHEN JIAYZ PHOTO INDUSTRIAL ,LTD |
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Oct 22 2021 |
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Wired over ear headphone |
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Mar 12 2020 |
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Headset with hidden boom arm |
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SHENZHEN XUNWEIJIA TECHNOLOGY DEVELOPMENT CO., LTD. |
Headphone |
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Feb 09 2021 |
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Dec 02 2020 |
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Headphone |
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Nov 07 2007 |
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Headphones |
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Oct 18 2007 |
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Head set |
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Oct 18 2007 |
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Head set |
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Dec 01 2008 |
GN NETCOM A S |
Headphone |
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Aug 07 2009 |
Kabushiki Kaisha Audio-Technica |
Headphone |
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Mar 11 2010 |
Apple Inc |
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Aug 12 2009 |
Sony Corporation |
Headphone |
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Aug 12 2009 |
Sony Corporation |
Headphone |
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Oct 05 2009 |
Kabushiki Kaisha Audio-Technica |
Headphone |
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Aug 02 2010 |
CREATIVE TECHNOLOGY LTD |
Headphones |
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Jan 31 2011 |
Microsoft Corporation |
Headset |
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Mar 09 2011 |
Samsung Electronics Co., Ltd. |
Wireless headset |
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Sep 21 2011 |
Bose Corporation |
Headset |
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Feb 10 2011 |
MMD HONG KONG HOLDING LIMITED |
Headphone |
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Aug 16 2011 |
Signeo USA, LLC |
Headphones |
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Sep 21 2011 |
Cheng Uei Precision Industry Co., Ltd. |
Stereo headset |
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Jan 17 2012 |
CREATIVE TECHNOLOGY LTD |
Headphone |
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Oct 07 2011 |
WESC AB PUBL |
Headphones |
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Oct 07 2011 |
WeSC AB (publ) |
Headphones |
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Dec 19 2011 |
SKULLCANDY, INC |
Headphone |
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Mar 17 2012 |
Hewlett-Packard Development Company, L.P. |
Headset |
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Jan 10 2012 |
SENNHEISER CONSUMER AUDIO GMBH |
Headphones |
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Jun 15 2010 |
RAZER ASIA-PACIFIC PTE LTD |
Headset |
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Sep 19 2012 |
Harman International Industries, Incorporated |
Headphones |
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Aug 28 2012 |
Monster, LLC |
Headphones |
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Aug 22 2012 |
SKULLCANDY, INC |
Headset |
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Aug 29 2012 |
Yoga Electronics Co., Ltd. |
Headphones |
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Dec 19 2011 |
SKULLCANDY, INC |
Headphone |
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Feb 18 2013 |
Panasonic Corporation |
Headphones |
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Dec 05 2013 |
Bose Corporation |
Headphones |
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Feb 20 2014 |
MOTOROLA SOLUTIONS, INC.; MOTOROLA SOLUTIONS, INC |
Earpiece audio device |
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Sep 04 2013 |
Harman International Industries, Incorporated |
Headphones |
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May 28 2014 |
GN NETCOM A S |
Communication headset |
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Sep 04 2013 |
Zound Industries International AB |
Headphone |
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Jul 24 2015 |
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
Headphone |
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Mar 03 2015 |
DSP Group Ltd |
Headphone |
D787470, |
Dec 10 2015 |
SKULLCANDY, INC |
Headphone |
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Feb 23 2016 |
Harman International Industries, Incorporated |
Side portion of earphone |
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May 16 2016 |
KENU, INC. |
Headphone |
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Mar 15 2016 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Headset |