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The ornamental design for a headphone, as shown and described. |
FIG. 1 is a top plan view of a headphone, showing my new design;
FIG. 2 is a left-side elevational view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a right-side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view thereof; and,
FIG. 8 is a perspective view thereof shown with headband in the extended position.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 21 1991 | Sony Corporation | (assignment on the face of the patent) | / | |||
Dec 02 1991 | YAMAZAKI, AKIRA | SONY CORPORATION A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005950 | /0968 |
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