Patent
   D944759
Priority
Dec 27 2019
Filed
Dec 27 2019
Issued
Mar 01 2022
Expiry
Mar 01 2037
Assg.orig
Entity
unknown
44
84
n/a
The ornamental design for a headphone, as shown and described.

FIG. 1 is a perspective view of a headphone showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is a side elevational view of the opposite side thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a perspective view of another embodiment of a headphone showing the new design;

FIG. 9 is a front elevational view thereof;

FIG. 10 is a rear elevational view thereof;

FIG. 11 is a side elevational view thereof;

FIG. 12 is a side elevational view of the opposite side thereof;

FIG. 13 is a top plan view thereof; and,

FIG. 14 is a bottom plan view thereof.

The broken lines immediately adjacent the shaded areas represent the bounds of the claimed design while all other broken lines are directed to environment; the broken lines form no part of the claimed design.

Vaclavik, Ondrej

Patent Priority Assignee Title
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D964960, Aug 23 2021 Wired over ear headphone
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D968359, Dec 14 2020 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.; PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO , LTD Headphone
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//
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Dec 27 2019Harman International Industries, Incorporated(assignment on the face of the patent)
Jan 07 2021VACLAVIK, ONDREJHarman International Industries, IncorporatedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0548460708 pdf
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