|
The ornamental design for a headphone, as shown and described. |
FIG. 1 is a top, front, and left-side perspective view of a headphone, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left-side elevational view thereof;
FIG. 5 is a right-side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Yamatogi, Katsumi, Daido, Fumitake
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 28 1989 | DAIDO, FUMITAKE | SONY CORPORATION, 7-35 KITASHINAGAWA-6, SHINAGAWA-KU, TOKYO, JAPAN, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005057 | /0092 | |
Mar 02 1989 | YAMATOGI, KATSUMI | SONY CORPORATION, 7-35 KITASHINAGAWA-6, SHINAGAWA-KU, TOKYO, JAPAN, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005057 | /0092 | |
Mar 24 1989 | Sony Corporation | (assignment on the face of the patent) | / |
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