Patent
   D888010
Priority
Dec 28 2017
Filed
Jan 13 2020
Issued
Jun 23 2020
Expiry
Jun 23 2035
Assg.orig
Entity
unknown
17
80
n/a
The ornamental design for a headphone, as shown and described.

FIG. 1 is a perspective view of a headphone showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is an opposite side elevational view thereof.

The broken lines shown in the drawings depict portions of the headphone that form no part of the claimed design.

Lindenberger, Laurent

Patent Priority Assignee Title
11700474, Jun 24 2021 NEW AUDIO LLC Multi-microphone headset
D940686, Sep 13 2019 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Communications headset
D944760, Jan 02 2020 Harman International Industries, Incorporated Headphone
D949822, Nov 01 2019 JVCKENWOOD Corporation Headphone
D960863, May 22 2020 SONY INTERACTIVE ENTERTAINMENT INC. Headphone
D966228, Dec 18 2020 Shure Acquisition Holdings, Inc Headphones
D978825, Jan 04 2021 Harman International Industries, Incorporated Headphone
D982551, Dec 17 2020 YEALINK (XIAMEN) NETWORK TECHNOLOGY CO., LTD. Wireless headphone
D987598, Dec 17 2020 YEALINK (XIAMEN) NETWORK TECHNOLOGY CO., LTD. Wireless headphone
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Jan 13 2020Harman International Industries, Incorporated(assignment on the face of the patent)
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