FIG. 1 is a perspective view of a headset.
FIG. 2 is another perspective view of the headset.
FIG. 3 is a top view of the headset.
FIG. 4 is a front view of the headset.
FIG. 5 is a side view of the headset.
FIG. 6 is a side view of the headset.
FIG. 7 is a rear view of the headset.
FIG. 8 is a bottom view of the headset.
FIG. 9 is a perspective view of the headset having a microphone disconnected; and,
FIG. 10 is the front view of the headset having the microphone disconnected.
The broken lines depict environment that forms no part of the claimed design.
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May 29 2017 |
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May 11 2017 |
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Mar 27 2017 |
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Mar 30 2017 |
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Feb 27 2018 |
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Jan 15 2018 |
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Gaming headset |
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Sep 11 2019 |
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Jan 15 2018 |
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Gaming headset |
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Mar 30 2017 |
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Aug 01 2018 |
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Dec 28 2017 |
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Jan 03 2019 |
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Jan 06 2020 |
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Jun 24 2019 |
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Aug 01 2018 |
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Dec 24 2019 |
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Dec 24 2019 |
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Dec 24 2019 |
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Nov 01 2019 |
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Jul 16 2020 |
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Dec 19 2019 |
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Headset |
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Dec 19 2019 |
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Mar 17 2020 |
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Headset for telephone |
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Aug 28 2020 |
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Headset |
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Aug 28 2020 |
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Aug 28 2020 |
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Dec 19 2019 |
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Aug 28 2020 |
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Apr 21 2021 |
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May 26 2021 |
YI ZHAO (SHENZHEN) CO., LIMITED |
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Dec 08 1992 |
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Sep 30 1998 |
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Feb 25 2003 |
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Jan 31 2003 |
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Headset with moveable earphones |
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Jan 24 2002 |
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Sep 05 2002 |
Sony Corporation |
Combined headphone and microphone |
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Feb 11 2003 |
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Headphone |
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Mar 07 2006 |
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Aug 26 2008 |
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May 19 2008 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
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Jan 07 2009 |
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Headphone |
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Aug 07 2009 |
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Mar 03 2010 |
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